EN 
Two Component Epoxies
Incure Two Part Epoxy Adhesives are suitable for bonding a wide variety of materials such as ceramic, glass, metal and plastic. Available in a variety of formulations, capabilities and performance, including fast cure, ease of handling, high toughness, moisture resistance, and resistance to a wide range of chemicals.
| Overview of Product Spectrum | ||||||||||||
| Product | Application | Color |
Viscosity, cps | Hardness | Pot Life | |||||||
| (Part A) | (Part B) | (Part A) | (Part B) | Shore | ||||||||
| 6400 | High adhesion strength, grease resistance, chemical and solvent resistance. Bond to ceramics, glass, plastics and metals. Recommended as a general adhesive where convience and speed at room temperature is desired. |
Colorless | Light Yellow | 12,000 - 17,000 | 12,000 - 17,000 | D84 | 3 mins | |||||
| 6401 | Toughened epoxy. Cured resin forms a tough, off-white bond-line which provides high peel and shear strength in the same time. The crack and fatigue resistance of this product are outstanding in many vibration applications. Bond to ceramics, glass, plastics and metals. |
Milky White | Yellow | 13,000 – 19,000 | 12,000 – 18,000 | D82 | 30 mins | |||||
| 6403 | For steel plate, tetron fiber and aluminum frames bonding. Easy to operate and exhibits perfect bonding for different substrates. High adhesion strength, greasy resistance, chemical and solvent resistance. Has anti-static property and is suited for metals and plastics, such as PC and ABS bonding. |
Colorless | Light Brown | 9,000 – 19,000 | 10,000 – 32,000 | D80 | 30 mins | |||||
| 6404 | Low viscosity, structural bonding adhesive. Good handling, chemical resistance and perfect surface gloss. For metal bonding and joining materials including electronic devices, ceramics, and plastics. |
Clear | Brown | 10,000 – 20,000 | 10,000 – 30,000 | D78 | 15 mins | |||||
| 6405 | Low viscosity, structural bonding adhesive. Good handling, chemical resistance and perfect surface gloss. Formetal bonding and joining materials including electronic devices, ceramics, and plastics. |
Clear | Brown | 10,000 – 20,000 | 25,000 – 45,000 | D78 | 30 mins | |||||
| 6407 | High adhesion strength, greasy resistance, chemical and solvent resistance.For steel plate, tetron fiber and aluminum frames bonding. Easy to operate and exhibits perfect bonding for different substrates. Has anti-static property. |
Grey | White | 30,000 – 70,000 | 17,000 – 47,000 | D80 | 5 mins | |||||
| 6408 | Toughened epoxy. Cured epoxy forms a tough, off-white bondline which provides high peel and shear strength. The crack and fatigue resistance is outstanding in many vibrational applications. For bonding plastics, metals, glass and ceramics. |
Black | Yellow | 29,000 – 34,000 | 14,000 – 24,000 | D82 | 30 mins | |||||
| 6409 | Fast cure at low temperature and easy to operate. This product is well suited for structural substrates. |
Black | Yellow | 25,000 – 35,000 | 21,000 – 41,000 | D85 | 30 mins | |||||
| 6411 | Low viscosity, good transparency, perfect surface gloss and high adhesion strength. Fast cure at low temperature and is suited for metals, glasses, ceramics, and plastics bonding. |
Colorless | Light Yellow | 5,000 – 13,000 | 5,000 – 9,000 | D83 | 30 mins | |||||
| 6414 | Fast cure at low temperature and easy to operate. Has insulation, chemical resistance and excellent electrical properties. Suitable applications includes decorative arts, crafts, glass bonding and repair. |
White | Yellow | 7,000 – 17,000 | 13,000 – 18,000 | D80 | 15 mins | |||||
| 6415 | Good handling properties, thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. Widely use in applications like electronic devices bonding, sealing, casting and potting. |
Black | Yellow | 3,000 – 7,000 | 4,000 – 8,000 | D70 | 30 mins | |||||
| 6416 |
Good handling properties and can be cured at low temperature. High toughness, high insulation and thermal shock resistance. For electronic devices bonding, sealing, casting, potting and encapsulation. |
Light Yellow | Black | 11,0000 – 11,1000 | 37,100 – 38,000 | D78 | - | |||||
| 6417 | Low viscosity, good handling, chemical resistance and perfect surface gloss. Tough, strong, structural bonds that provides excellent shear, peel and impact strength. For metal bonding and joining materials including composites and plastics. The crack and fatigue resistance of this epoxy is outstanding in many vibration applications. | Black | Yellow | 17,000 – 29,000 | 16,000 – 36,000 | D75 | 20 mins | |||||
| 6420 | High adhesion strength, greasy resistance, chemical and solvent resistance.Good electrical insulation properties, and it is suited for glass, ceramics, plastics and metals bonding. |
Grey to White | Grey to White | 12,0000 – 24,0000 | 17,000 – 27,000 | D87 | 10 mins | |||||
| 6423 | Toughened epoxy. Excellent shear, peel and impact strength. Good adhesion strength, thermal shock resistance, chemical and solvent resistance. Cure at room temperature and exhibit good electrical insulation. For metal, plastics and ceramics bonding. |
Milky White | Amber | 21,000 – 40,000 | 13,000 – 20,000 | D80 | 50 mins | |||||
| 6424 | The crack and fatigue resistance is outstanding in many vibration applications. Exhibits perfect surface gloss. Recommended as a general adhesive where convenience and speed at room temperature is desired. For use as a general adhesive for bonding plastics, metals and some construction materials. | White | Yellow | 30,000 – 60,000 | 20,000 – 36,000 | D84 | 20 mins | |||||
| 6427 | For PC to silicon rubber bonding. Tough and flexible. Used for screen printing for its performance and reliability. | Light Yellow | Light Yellow | 750 – 1,500 | <500 | D79 | 30 mins | |||||
| 6428 | Durable and tough. High peel and shear strength epoxy. The crack and fatigue resistance of this resin are outstanding in many vibration applications. For plastics, metals, glass and ceramics bonding. | Milky White | Yellow | 22,000 – 34,000 | 47,000 – 72,000 | D76 | 20 – 30 mins | |||||
| 6429 | High viscosity, high Tg 2-part epoxy adhesive. For electronic device bonding. An elevated temperature post-cure is necessary to obtain maximum high-temperature stability and optimum properties. |
Light Grey | Brown | 186,000 – 435,000 | 58,800 – 137,500 | D90 | 30 mins | |||||
| 6430 | Good handling and perfect surface gloss. Cured Extremely flexible, toughened epoxy. For metal, devices bonding, such as wood, ceramics, glass, rubber and plastics. Cured product exhibits high toughness and outstanding flexibility, is recommended as a general adhesive for bonding dissimilar surface where thermal stress induced by temperature may be an issue. Good thermal shock resistance and low exotherm.Maintains essentially constant elongation and low embedment stressat high temperature. For electronic devices, stainless steel and glass fiber sealing. |
Beige | Grey | 150,000 – 240,000 | 300,000 – 500,000 | D75 | 30 mins | |||||
| 6431 | High performance epoxy. Low stress and low shrinkage. High elasticity and good handling properties. Recommended as a general adhesive where convenience and speed is desired. Thermal shock resistance. |
Black | Amber | 300 – 500 | 600 – 1,000 | A48 | 4 – 6 hrs | |||||
| 6433 | High toughness, durability and outstanding flexibility. Recommended as a general adhesive for bonding dissimilar surface where thermal stress induced by temperature may be an issue. Suitable for low-stress potting. |
Colorless | Light Yellow | 7,300 | 13,500 | D54 | 3 – 5 mins | |||||
| 6434 | Epoxy for electronic devices with high adhesion strength. Excellent fluidity, good surface gloss and adhesion strength. Fast curing at low temperature. | White | Dark Grey | 40,000 – 60,000 | 58,000 – 90,000 | D70 | 30 mins | |||||
| 6446 | High adhesion strength, greasy resistance, chemical and solvent resistance. For plastics, ceramics, glass and metals bonding. Recommended as a general adhesive where convience and speed at room temperature is desired. |
Colorless | Light Yellow | 16,000 – 24,000 | 12,000 – 17,000 | D85 | 3 mins | |||||
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