Microelectronics need protection? UV curable encapsulants offer rapid curing & robust defense against moisture & stress. Learn more. Microelectronics are the building blocks of modern technology, powering everything from smartphones to medical devices. Protecting these delicate components during assembly and throughout their lifespan is crucial for ensuring device reliability. This blog explores UV light curable encapsulants, a revolutionary solution for microelectronic assembly and integrated circuit (IC) protection. What are UV Light Curable Encapsulants? UV light curable encapsulants are specialized liquid materials that solidify upon exposure to ultraviolet (UV) light. Here's what makes them ideal for microelectronics: Fast Curing: Exposure to UV light triggers rapid polymerization, creating a protective layer around the microelectronic components within seconds or minutes. This expedites assembly processes compared to traditional methods. Conformal Coating: The liquid form fills even the most intricate gaps and contours on the microelectronic components, providing a seamless and complete encapsulation. Excellent Protection: Cured encapsulants offer superior protection against moisture, contamination, mechanical stress, and environmental factors that can damage delicate electronic components. Transparent and Low Outgassing: Encapsulants are typically clear, allowing for easy visual inspection of components. They also exhibit minimal emission of volatile organic compounds (VOCs) during curing, minimizing potential harm to components. Variety of Formulations: Available in various viscosities and with different properties to cater to specific needs, such as thermal conductivity or flame retardancy. Benefits of UV Light Curable Encapsulants for Microelectronics UV light curable encapsulants offer significant advantages over traditional encapsulation methods: Increased Throughput: Fast curing times significantly reduce assembly times compared to heat-cured epoxies, boosting production efficiency. Improved Quality Control: Rapid curing minimizes the risk of component damage from prolonged exposure to heat. Enhanced Reliability: Superior protection against environmental factors leads to more reliable and longer-lasting microelectronic devices. Simplified Processing: One-part formulations eliminate the need for complex mixing procedures, simplifying application. Environmentally Friendly: UV curing reduces energy consumption compared to heat-curing methods. Certain formulations offer low VOC emissions. Incure Encap™ Series Core Products Product Description Substrates Color Viscosity (cP) Tensile Strength (psi) Hardness (Shore D) Elongation (%) 3522 Low viscosity encapsulant providing a clear, hard, sleek, and resilient protective coating (300-4,500 microns). Very low water absorption for reliable performance in Singapore's humid climate. Low Adhesion Clear 20 150 84 - 94 4 3555 Ultra-low stress, clear electronic component encapsulant with fast curing and good light transmission. Enhanced moisture and temperature resistance. Gentle on flexible circuits. Multi-Substrates (Low Adhesion) Clear 20 4,150 63 - 73 32 Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail Applications for UV Light Curable Encapsulants The versatility and protective properties of UV light curable encapsulants make them ideal for various microelectronic assembly and IC protection applications: Chip-on-Board (COB) Assembly: Encapsulate delicate electronic components directly onto printed circuit boards (PCBs). Ball Grid Array (BGA) Encapsulation: Protect BGA packages used in high-density electronic…