Ultraviolet Curing Medical Device Adhesives – INCURE

Speed, precision, and biocompatibility: Discover the advantages of UV light curable adhesives for medical device assembly. Learn more.In the world of medical device assembly, precision, reliability, and biocompatibility are king. Traditional adhesives can introduce complexities, but UV light curable adhesives offer a shining solution. Let's explore why these adhesives are transforming medical device assembly. Advantages of UV Light Curable Adhesives: Fast and Precise Curing: Exposed to UV light, these adhesives cure in seconds, accelerating production and reducing reliance on heat-sensitive components. Targeted Control: Light allows for pinpoint curing, ideal for intricate assemblies and minimizing adhesive waste. Strong and Sterilizable: UV curable adhesives form high-strength bonds that withstand demanding medical environments and can often be sterilized with common methods like autoclaving. Solvent-Free: These adhesives minimize health risks and environmental impact compared to solvent-based alternatives. Biocompatible Options: Many UV curable adhesives are formulated to meet biocompatibility standards, ensuring patient safety. Incure Cyro-Weld™ Series Core Products Product Description Substrates Color Viscosity (cP) Tensile Strength (psi) Hardness (Shore D) Elongation (%) 5005 High-strength multi-substrate bonder for demanding medical applications. Offers adaptability, strength, and rapid cure. Tough-yet-flexible material with high reliability. Passes EtO and gamma sterilization. High Strength Plastics Transparent Clear 3,500 - 5,500 3,200 - 6,900 51 - 61 812 5021F Low viscosity, multi-substrate bonder for plastics, metal, and glass. Ideal for needle, reservoir, catheter, and transducer assemblies. ISO 10993-5 compliant. Passes EtO and gamma sterilization. Multi-Substrates (High Strength Plastics) Clear 100 - 200 4,200 - 7,000 68 - 78 82 5040F Medical grade, low viscosity bonder for respiratory face masks and needle-bonding. Bonds plastics, glass, and metals. Dissimilar substrate bonding with varying elasticity. Fluoresces for quality inspection. Multi-Substrates (Plastics) Slight Yellowish Tint, Fluorescing 80 - 180 3,200 - 6,900 80 - 90 1 5291 Low viscosity, multi-substrate bonder for plastics, metal, and glass. Ideal for needle, reservoir, catheter, and transducer assemblies. ISO 10993-5 compliant. Passes EtO and gamma sterilization. High elongation for flexible applications. Multi-Substrates (High Strength Plastics) Slight Tint 150 - 300 4,200 - 7,100 72 - 82 92 5302 Medical grade, low viscosity multi-substrate bonder. Good passive vibration isolation and extremely low shrinkage. Suitable for sealant and gasket applications. Multi-Substrates Clear 200 - 500 3,100 - 3,800 15 - 25 812 5303FT Manufacture of gel-pads for silicon wafers and laminates. High-tack feel. Low water absorption and shrinkage. Transparent and fluorescing for inspection. 100% solids, no volatiles. Multi-Substrates (High Strength Plastics) Transparent, Fluorescing 5,000 - 9,000 1,000 - 2,200 7 - 17 (Shore A) 737 5414 Low viscosity, acid-free FIPG/CIPG gasket and sealant for medical devices. Very low linear shrinkage. Ideal for medical optics positioning. Adheres well to glass, metals, ceramics, and plastics. Multi-Substrates (High Strength Plastics) Slight Yellowish Tint, Clear 2,000 - 3,500 3,300 - 7,100 68 - 78 73 5454 Medium viscosity, high-strength medical grade PC/TPE bonder with enhanced temperature and moisture resistance. ISO 10993-5 compliant. Multi-Substrates (Plastics) Slight Yellowish Tint, Clear 1,000 - 2,000 1,600 - 6,500 25 - 35 230 5942 Medical grade, low viscosity bonder for respiratory…

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Light Up Your Assembly Line: Advantages, Applications, and Choosing the Right Light-Curable Adhesives for Electronics

In the fast-paced world of electronics assembly, efficiency and precision are paramount. Traditional adhesives often require long curing times and can be messy to apply. Here's where light-curable adhesives enter the scene, offering a revolutionary solution for electronics assembly. Advantages of Light-Curable Adhesives:Lightning-Fast Curing: Exposed to high-intensity UV/visible light, these adhesives cure in seconds, significantly boosting production speed.On-Demand Curing: Curing happens only when exposed to light, eliminating adhesive migration and rework.Precise Control: Targeted light application allows for selective curing, ideal for complex assemblies.Solvent-Free: Light-curable adhesives are often solvent-free, minimizing environmental impact and health risks.Strong and Versatile: They offer excellent adhesion to various electronics materials and deliver strong, durable bonds. Applications for Light-Curable Adhesives in Electronics Assembly:Wire Tacking & Component Ruggedization: Securely hold wires and components in place for subsequent soldering or other processes.BGA & Leadless Component Support: Provide robust support for ball grid array (BGA) and leadless components to prevent electrical and mechanical stress.Strain Relief: Effectively absorb stress on wires and connectors, enhancing reliability.Conformal Coating: Light-curable materials can be used for conformal coatings, protecting electronics from dust, moisture, and other environmental factors.Encapsulation: Fully encapsulate delicate electronic components for superior protection and environmental sealing. Choosing the Right Light-Curable Adhesive: Selecting the ideal light-curable adhesive for your electronics assembly needs requires considering several factors:Material Compatibility: Ensure the adhesive adheres well to your specific substrates (e.g., FR4, ceramics, metals).Viscosity: Opt for high viscosity for gap filling or lower viscosity for easier application on fine components.Curing Speed: Select the curing speed that best suits your production line throughput.Light Source Compatibility: Match the adhesive's curing wavelength with your UV/visible light source.Thermal Performance: Consider the operating temperature range of your electronics and choose an adhesive with suitable thermal resistance. Conclusion: Light-curable adhesives are a game-changer for electronics assembly, offering a winning combination of speed, precision, and control. By understanding their advantages, diverse applications, and key selection factors, you can leverage these innovative materials to optimize your assembly process and achieve superior results. Bonus Tip: For additional insights, explore the latest advancements in light-curable adhesives, such as those with unique properties like flexibility or enhanced chemical resistance, to further elevate your electronics assembly capabilities. Incure Uni-Weld™ Series Core Products - Metal Bonder Uni-Weld™ 1283 Incure Uni-Weld™ 1283: UV/Visible/Heat Cure Bonder (Relays/Circuit Breakers) - Outdoor Electronics (Clear, Heat/Moisture/Vibration Resistant) Uni-Weld™ 1203 Incure Uni-Weld™ 1203: Tack-Free UV Bonder (High Strength) - Metals/Glass/Ceramics (Low Shrink, Heat/Moisture/Vibration Resist) Incure Uni-Weld™ Series Core Products - Plastic Bonder Uni-Weld™ 1462 Incure Uni-Weld™ 1462: Low Viscosity, Acid-Free UV Bonder (Multi-Material) - Electronics (Metals/Glass/FR4) Uni-Weld™ 1483 Incure Uni-Weld™ 1483: Mid Viscosity, Acid-Free UV Bonder (Electronics) - Multi-Material (Metals/Glass/FR4) Uni-Weld™ 1063 Incure Uni-Weld™ 1063: Low Viscosity, Acid-Free UV Bonder (Electronics) - Multi-Material (Metals/Glass/FR4) Incure Uni-Seal™ Series Core Products - Potting Uni-Seal™ 6213HT Incure Uni-Seal™ 6213HT: Cost-Effective Epoxy-Acrylate Potting (Electronics) - Thick, Low Shrink/Water Absorp. (UV/Heat, Chemical/Vapor Resist) Uni-Seal™ 3393 Incure Uni-Seal™ 3393: Low Viscosity, Low Water Absorp. Electronics Sealant (Air-Tight, Peelable, Tough/Elongating) - Auto/Electronics (Low CTE) Uni-Seal™ 6213 Incure Uni-Seal™ 6213: Low-Cost Epoxy-Acrylate Potting (Electronics) -…

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